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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC2766GR/GS
WIDE BAND IQ DEMODULATOR FOR DIGITAL VIDEO/DATA RECEIVER
DESCRIPTION
The PC2766GR/GS is a Silicon monolithic IC designed for use as IQ demodulator in wide dynamic range compressed video or spread spectrum receivers. This IC consists of a wide band RF amplifier, gain control amplifier, dual balanced mixers (DBM), Lo buffers, and I & Q output buffer amplifiers. The package is 20 pin SSOP (shrink small outline package: PC2766GR) or 20 pin SOP (PC2766GS) suitable for high-density surface mount.
FEATURES
* Broadband operation RF & LO up to 1 000 MHz IF (IQ) up to 200 MHz * Wideband IQ phase and amplitude balance * AGC dynamic range * Low distortion; IM3 * Supply Voltage 45 dB 30 dBc 5V Amplitude balance Phase balance 0.3 dB (TYP.) 0.3 degree (TYP.)
* Packaged in 20 pin SSOP or 20 pin SOP suitable for high-density surface mount
ORDERING INFORMATION
PART NUMBER PACKAGE 20 pin plastic SSOP (225 mil) 20 pin plastic SOP (300 mil) PACKAGE STYLE Embossed tape 12 mm wide. 2.5 k/REEL Pin 1 indicates pull-out direction of tape Embossed tape 24 mm wide. 2.5 k/REEL Pin 1 indicates pull-out direction of tape
PC2766GR-E1 PC2766GS-E1
Caution electro-static sensitive device
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P10193EJ4V0DS00 (4th edition) Date Published October 1999 N CP(K) Printed in Japan
The mark
shows major revised points.
(c)
1995, 1999
PC2766GR/GS
INTERNAL BLOCK DIAGRAM
I out 20
I out GND IF. I 19 18
Lo I 17
Lo I 16
Lo Q Lo Q GND Q out Q out IF. Q 15 14 13 12 11
I-IF Amp. I-Lo.Buff.Amp I-MIX.
I-IF Amp. I-Lo.Buff.Amp Q-MIX.
RF AGC RF Pre.Amp 1 I trim 2 Vcc IF. I 3 Vcc RF 4 5 6 AGC cont. 7 8 9 10
GND RF in RF in GND Vagc Vcc Q trim RF RF IF. Q
2
Data Sheet P10193EJ4V0DS00
PC2766GR/GS
PIN FUNCTIONS
PIN No. PIN NAME 1 I Trim PIN VOLTAGE TYP. (V) 4.2 FUNCTION AND EXPLANATION Trimming pin for I-IF output. EQUIVALENT CIRCUIT
VCC 1
2 3
VCCIF I VCCRF
5.0 5.0
Power supply pin for I-MIXER. Power supply pin for RF and AGC block. Ground pin of RF and AGC block. RF input pin. In case of single input, 6 pin should be grounded through capacitor.
To next block 6
4 5
GND RF RFin
0.0 2.6
6
RFin
2.6
5
7 8
GND RF VAGC
0.0 0 to 5
Ground pin of RF and AGC block. Gain control pin. * VAGC = 0 V: Full gain * VAGC = 5 V: Maximum reduction
VCC 8
9 10
VCCIF Q Q Trim
5.0 4.2
Power supply pin for Q-MIXER. Trimming pin for Q-IF output. VCC 10
Data Sheet P10193EJ4V0DS00
3
PC2766GR/GS
PIN VOLTAGE TYP. (V) 3.3
PIN No. PIN NAME 11 Qout
FUNCTION AND EXPLANATION Q-IF output pin. 11 pin and 12 pin are balance outputs.
12
EQUIVALENT CIRCUIT
VCC
12
Qout
3.3
+
11 From before _ block
13 14
GNDIF Q Lo Q
0.0 2.2
Ground pin of Q-IF block. Oscillator signal input pin of Q-MIXER. In case of single input, 15 pin should be grounded through capacitor. VCC
15
Lo Q
2.2
14
15
16
Lo I
2.2
Oscillator signal input pin of I-MIXER. In case of single input, 16 pin should be grounded through capacitor.
VCC
17
Lo I
2.2
17
16
18 19
GNDIF I Iout
0.0 3.3
Ground pin of I-IF block. I-IF output pin. 19 pin and 20 pin are balance outputs.
19 + VCC
20
Iout
3.3
20 From before _ block
4
Data Sheet P10193EJ4V0DS00
PC2766GR/GS
ABSOLUTE MAXIMUM RATINGS (TA = 25 C)
PC2766GR
PARAMETER Supply voltage Power dissipation Operating temperature range Storage temperature range SYMBOL VCC PD TA Tstg RATING 6.0 430 -40 to +85 -55 to +150 UNIT V mW C C TA = 85 CNote 1 TEST CONDITIONS
PC2766GS
PARAMETER Supply voltage Power dissipation Operating temperature range Storage temperature range SYMBOL VCC PD TA Tstg RATING 6.0 650 -40 to +85 -55 to +150 UNIT V mW C C TA = 85 CNote 1 TEST CONDITIONS
Note 1 Mounted on 50 x 50 x 1.6 mm double epoxy glass board. RECOMMENDED OPERATING RANGE
PC2766GR/GS
PARAMETER Supply voltage Operating temperature range SYMBOL VCC TA MAX. 4.5 -40 TYP. 5.0 +25 MIN. 5.5 +85 UNIT V C
Data Sheet P10193EJ4V0DS00
5
PC2766GR/GS
ELECTRICAL CHARACTERISTICS (VCC = 5 V, TA = 25 C,ZL = 250 )
PC2766GR/GS
PARAMETER Supply current RF input bandwidth SYMBOL ICC RF BW MIN. - DC 750 DC TYP. 60 DC 1000 200 MAX. 78 - UNIT mA MHz TEST CONDITIONS no input signal fIF = 40 MHz, fRF > fLO IQ phase balance 1.5 fRF = 480 MHz, PLO = -10 dBm fRF > fLO, -3 dB down, Vagc = 0 V fRF = 480 MHz, fIF = 40 MHz PRF = -30 dBm, PLO = -10 dBm Vagc = 0 - 5 V fRF = 480 MHz, fIF = 40 MHz PRF = -30 dBm, PLO = -10 dBm IQ amplitude balance
IF output bandwidth
IF BW
-
MHz
Gain control range
GGC
40
45
-
dB
IQ phase balance
G
-
0.3 0.3
1.5 0.5
deg
-
dB
fRF = 480 MHz, fIF = 40 MHz PRF = -30 dBm, PLO = -10 dBm Vagc = 0 V fRF = 480 MHz, fIF = 40 MHz PLO = -10 dBm, ZL = 250 fRF = 480 MHz, fIF = 40 MHz Vagc = 0 V
Output voltage
VO
1.2
1.5
-
VP-P
Conversion gain
CG
15
20
25
dB
STANDARD CHARACTERISTICS (REFERENCE VALUES) (VCC = 5 V, TA = 25 C,ZL = 250 )
PC2766GR/GS
PARAMETER Noise figure SYMBOL NF MIN. - TYP. 21 MAX. - UNIT dB TEST CONDITIONS fRF = 480 MHz, fIF = 40 MHz PLO = -10 dBm, Vagc = 0 V fLO = 440 MHz, PLO = -10 dBm Vagc = 0 V fLO = 440 MHz, PLO = -10 dBm Vagc = 0 V fRF1 = 480 MHz, fRF2 = 490 MHz fLO = 440 MHz, Pin = -20 dBm PLO = -10 dBm, Vagc = 1 V fRF = 480 MHz, fIF = 40 MHz PRF = -10 dBm
LO to RF isolation
LO-RFisol
-
55
-
dB
LO to IF isolation
LO-IFisol
-
10
-
dB
3rd order intermodulation distortion
IM3
-
30
-
dBc
Saturated output level
PO(SAT)
-
+2
-
dBm
6
Data Sheet P10193EJ4V0DS00
PC2766GR/GS
TYPICAL CHARACTERISTICS - on Measurement Circuit - (Note 2 Lower local)
CG vs. fRF (Iout) 35
CG _ Conversion Gain _ dB CG _ Conversion Gain _ dB
CG vs. fRF (Qout) 35 fIF = 40 MHz PLO = _10 dBm 30 Vagc = 0 V Note 2 25 20 15 10 5 TA = 25 C TA = 85 C TA = _40 C
fIF = 40 MHz PLO = _10 dBm 30 Vagc = 0 V Note 2 25 20 15 10 5 TA = 25 C TA = 85 C TA = _40 C
0.1 0.5 1 fRF _ RF Frequency _ GHz
5
0.05
0.1
0.5 1 fRF _ RF Frequency _ GHz
5
CG vs. fIF (Iout) 30
CG _ Conversion Gain _ dB CG _ Conversion Gain _ dB
CG vs. fIF (Qout) 30 TA = _40 C 25 20 15 10 5 0 TA = 85 C TA = 25 C fRF = 480 MHz PRF = _30 dBm PLO = _10 dBm Vagc = 0 V Note 2
TA = _40 C 25 20 15 10 5 0 _5 40 TA = 85 C TA = 25 C
fRF = 480 MHz PRF = _30 dBm PLO = _10 dBm Vagc = 0 V Note 2
60 80 100 200 fIF _ IF Frequency _ MHz
300
_5
40
60 80 100 200 fIF _ IF Frequency _ MHz
300
Pin vs. Pout (Iout)
Pout _ Output Power Level _ dBm
Pin vs. Pout (Qout) VCC = 5.5 V
Pout _ Output Power Level _ dBm
fRF = 480 MHz fIF = 40 MHz 0 PLO = _10 dBm Vagc = 0 V _5 Note 2 _10 _15 _20 _25 _40
5
VCC = 5.0 V VCC = 4.5 V
fRF = 480 MHz fIF = 40 MHz 0 PLO = _10 dBm Vagc = 0 V _5 Note 2 _10 _15 _20 _25 _40
5
VCC = 5.5 V VCC = 5.0 V VCC = 4.5 V
_30 _20 _10 0 Pin _ Input Power Level _ dBm
_30 _20 _10 0 Pin _ Input Power Level _ dBm
Data Sheet P10193EJ4V0DS00
7
PC2766GR/GS
IQ PHASE BALANCE vs. fRF IQ AMPLITUDE BALANCE vs. fRF 2
] (dB)
I Q
0
TA = _40 C TA = 85 C
1.5 1 0.5 0 _0.5 _1 fIF = 40 MHz PRF = _30 dBm _1.5 PLO = _10 dBm _2 Note 2 0.05 0.1 TA = 25 C TA = 85 C TA = _40 C
I-Q Phase Balance (
I Q
)
_5
TA = 25 C
_10
_15 fIF = 40 MHz PRF = _30 dBm PLO = _10 dBm Note 2 _20 0.05 0.1
I-Q Amplitude Balance [
0.5 1 _ RF Frequency _ GHz fRF
5
0.5 1 _ RF Frequency _ GHz fRF
5
IM3 _ Third Intermodulation Distortion _ dBc Pout _ Output Power Level _ dBm
IM3 vs. Pin (Iout)
fRF1 = 480 MHz fRF2 = 490 MHz 0 fLO = 440 MHz PLO = _10 dBm Pin = _20 dBm each _10 Vagc = 1.0 V
IM3 _ Third Intermodulation Distortion _ dBc Pout _ Output Power Level _ dBm
IM3 vs. Pin (Qout)
fRF1 = 480 MHz fRF2 = 490 MHz fLO = 440 MHz 0 PLO = _10 dBm Pin = _20 dBm each _10 Vagc = 1.0 V
10
10
VCC = 4.5 V
_20 _30 _40 _50 _60 _40 _30
VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V
_20 _30 _40 _50 _60 _40 _30
VCC = 5.0 V VCC = 5.5 V
_20
_10
0
_20
_10
0
Pin _ Input Power Level _ (dBm)
Pin _ Input Power Level _ (dBm)
CG vs. Vagc (Iout) 20 fRF = 480 MHz fIF = 40 MHz PRF = _30 dBm PLO = _10 dBm VCC = 5.0 V Note 2 20
CG vs. Vagc (Qout) fRF = 480 MHz fIF = 40 MHz PRF = _30 dBm PLO = _10 dBm VCC = 5.0 V Note 2
CG _ Conversion Gain _dB
10 0 _10 _20 _30
CG _ Conversion Gain _dB
5
10 0 _10 _20 _30
0
1
2 4 3 Vagc _ AGC Voltage _ V
0
1
2
3
4
5
Vagc _ AGC Voltage _ V
8
Data Sheet P10193EJ4V0DS00
PC2766GR/GS
IM3 vs. Vagc (Iout) fRF1 = 480 MHz fRF2 = 490 MHz fLO = 440 MHz Pin = _20 dBm each PLO = _10 dBm IM3 vs. Vagc (Qout) 0 _10 _20 _30 _40 _50 fRF1 = 480 MHz fRF2 = 490 MHz fLO = 440 MHz Pin = _20 dBm each PLO = _10 dBm
IM3 _ Third Intermodulation Distortion _ dBc
0 _10 _20 _30 _40 _50
IM3 _ Third Intermodulation Distortion _ dBc
0
1
2 3 4 Vagc _ AGC Voltage _ V
5
0
1
2 3 4 Vagc _ AGC Voltage _ V
5
IM3 _ Third Intermodulation Distortion _ dBc
IM3 _ Third Intermodulation Distortion _ dBc
IM3 vs. CG (Iout) 0 fRF1 = 480 MHz fRF2 = 490 MHz _10 fLO = 440 MHz Pin = _20 dBm each PLO = _10 dBm Vagc = 0 to 5 V _20 _30 _40 _50
IM3 vs. CG (Qout) 0 fRF1 = 480 MHz fRF2 = 490 MHz _10 fLO = 440 MHz Pin = _20 dBm each PLO = _10 dBm Vagc = 0 to 5 V _20 _30 _40 _50
_30
_20
_10 0 10 _ Conversion Gain _ dB CG
20
_30
_20
_10 0 10 _ Conversion Gain _ dB CG
20
Data Sheet P10193EJ4V0DS00
9
PC2766GR/GS
MEASUREMENT CIRCUIT (@ ZL = 250 )
Spectrum Analyzer 50 I out 200 Note 3 Power Divider 300 nH 8 pF 300 nH 250 1 000 pF 1 000 pF 1 000 pF 1 000 pF 1 000 pF 1 000 pF 250 8 pF 50 Q out 200 Note 3
OSC IN
1 000 pF 1 000 pF
20
19
18
17
16
15
14
13
12
11
I-IF Amp. I-Lo.Buff.Amp I-MIX.
Q-IF Amp. Q-Lo.Buff.Amp Q-MIX.
RF AGC RF Pre.Amp. 1 2 3 4 5 6 AGC cont. 8 9 10
7
1 000 pF 1 000 pF 1 000 pF
1 000 pF 1 000 pF
1 000 pF 1 000 pF 1 000 pF
SG RF IN Vagc Vcc
Note 3
is Low pass filter in order to eliminate local leak.
10
Data Sheet P10193EJ4V0DS00
PC2766GR/GS
APPLICATION CIRCUIT EXAMPLE
OSC IN
90 PHASE SHIFTER 0 I out I out 90 Q out Q out
LPF
LPF 1 000 pF 1 000 pF 17 16 15 14 13
LPF
LPF
1 000 pF 1 000 pF 20 19 18
1 000 pF 1 000 pF 12 11
I-IF Amp. I-Lo.Buff.Amp. I-MIX.
Q-IF Amp. Q-Lo.Buff.Amp. Q-MIX.
RF AGC RF Pre.Amp. 1 2 3 4 5 6 AGC cont. 7 8 9 10
1 000 pF 1 000 pF
1 000 pF 1 000 pF
1 000 pF 1 000 pF
1 000 pF 5 k RF IN Vagc Vcc 5 k
1 000 pF
I Bias Trim
Q Bias Trim
Data Sheet P10193EJ4V0DS00
11
PC2766GR/GS
PACKAGE DIMENSIONS
20 PIN PLASTIC SSOP (225 mil) (UNIT: mm)
20
11
detail of lead end
3-3
+7
1 6.7 0.3
10
1.8 MAX. 1.5 0.1
6.4 0.2 4.4 0.1 1.0 0.2
0.5 0.2 0.65 0.22 -0.05 0.1 0.1
+0.10
0.15 0.10 M
0.15 0.575 MAX.
+0.10 -0.05
NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition.
12
Data Sheet P10193EJ4V0DS00
PC2766GR/GS
20 PIN PLASTIC SOP (300 mil) (UNIT: mm)
20
11 detail of lead end
3 +7 -3 1 12.70.3 7.70.3 1.550.1 5.60.2 1.1 10
1.27 0.40.1 0.10.1 1.8 MAX. 0.12
M
0.78 MAX. 0.10
0.60.2 0.20 -0.05
+0.10
NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition.
Data Sheet P10193EJ4V0DS00
13
PC2766GR/GS
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used or in case soldering is done under different conditions. For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
PC2766GR
Soldering process Infrared ray reflow Soldering conditions Peak package's surface temperature: 235 C or below, Reflow time: 30 seconds or below (210 C or higher), Number of reflow process: 3, Exposure limit Note: None Peak package's surface temperature: 215 C or below, Reflow time: 40 seconds or below (200 C or higher), Number of reflow process: 3, Exposure limit Note: None Solder temperature: 260 C or below, Flow time: 10 seconds or below, Number of flow process: 1, Exposure limit Note: None Terminal temperature: 300 C or below, Flow time: 3 seconds or below, Exposure limit Note: None Symbol IR35-00-3
VPS
VP15-00-3
Wave soldering
WS60-00-1
Partial heating method
Note
Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 C and relative humidity at 65 % or less.
Caution
Do not apply more than single process at once, except for "Partial heating method".
14
Data Sheet P10193EJ4V0DS00
PC2766GR/GS
[MEMO]
Data Sheet P10193EJ4V0DS00
15
PC2766GR/GS
* The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
M7 98.8

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